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Technical Papers > Edition 2
In-line plasma-chemical etching of crystalline silicon wafers
Dorit Linaschke, Mattias Leistner, Gerrit Mäder, Wulf Grählert, Ines Dani & Stefan Kaskel, Fraunhofer IWS, Dresden, Germany
The etching technology currently used in the solar industry is mostly based on wet chemical processing. Plasmaenhanced dry chemical etching at atmospheric pressure is an alternative to the existing technology, especially when combined with similar process technologies, for example plasma-enhanced deposition techniques at atmospheric pressure, to provide a continuous in-line processing of crystalline silicon solar cells.
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