Your daily dose of photovoltaic technology developments and solar news

• Popular Technical Papers

  • Overview of automation in the photovoltaic industry
  • Understanding moisture ingress and packaging requirements for photovoltaic modules
  • Evaluation of encapsulant materials for PV applications
  • Inline processing of crystalline silicon solar cells: the holy grail for large-scale manufacturing?
  • PV sector outlook: an analyst’s perspective

• Featured Technical Papers

  • Transparent conducting oxide deposition techniques for thin-film photovoltaics
  • Comprehensive and advanced quality assurance measures for optimal yields from PV power plants
  • Surface passivation of silicon solar cells using industrially relevant Al2O3 deposition techniques
  • Influence of a-Si:H deposition temperature on thermal stability of a-Si:H/SiNx:H stacks
  • Integrated loops: a prerequisite for sustainable and environmentally-friendly polysilicon production

In today's market, crystalline silicon wafer technology dominates industrial solar cell production. Common devices feature opposing electrodes that are situated at the front and rear surface of the wafer and subsequent front-to-rear interconnection is used for module assembly. This paper reflects the functions which have to be fulfilled for the backside contact of the solar cell as well as challenges and advances for the two basic classes: full-area and local rear contact formation. While full-area contacting has proven to be a reliable technology for industrial production, local contacting through dielectric layers has yet to be put through its paces in industrial implementation.

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