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Cell interconnection is recognized as the most critical process with respect to module production yield. If the process is not carefully controlled, cell cracking and subsequent breakage may occur. Many manufacturers promise breakage rates below 0.3-0.5% on their tabber-stringers, which applies for cells above 160-180µm thickness that are free from initial cracks. In real production, this figure strongly depends on materials, process parameters and throughput. This paper outlines some approaches that should be taken to avoid high levels of breakage in the cell interconnection process.

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