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Multi-wire sawing is currently the most efficient slicing technology for silicon wafers in the photovoltaic industry. Nevertheless, the wafer producers are faced with major cost reductions in the production process and the demand for high-quality, very thin wafers with a total thickness variation less than 10% of the average wafer thickness. One approach to this is the understanding of the role of slurry, specifically the abrasives used in the multi-wire sawing process. In the past few years, more and more scientific investigations have been conducted and are summarised in this article.

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